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AP64102QSP-13 - Diodes Incorporated

Description: Switching Voltage Regulators DCDC Conv HV Buck SO-8EP T&R 4K

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AP64102QSP-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8(EP)_2024
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3D Models
AP64102QSP-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8(EP)_2024
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AP64102QSP-13 Details

  • Manufacturer Part Number:

    AP64102QSP-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • Additional Feature:

    PULSE FREQUENCY MODULATION TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.63 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    500 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

AP64102QSP-13 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the IC, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure the device is properly biased, make sure to follow the recommended voltage and current ratings, and provide a stable input voltage within the specified range. Also, ensure that the input and output capacitors are properly selected and placed close to the device.
  • Potential failure modes include overvoltage, overcurrent, and overheating. To mitigate these, ensure proper voltage and current limiting, use a suitable heat sink, and implement overtemperature protection. Additionally, follow proper PCB design and layout guidelines to minimize thermal and electrical stress.
  • Yes, the AP64102QSP-13 is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application. Additionally, consider using a device with a higher temperature rating and automotive-grade qualification.
  • To troubleshoot issues with the AP64102QSP-13, start by verifying the input voltage and current, and checking for proper PCB layout and component selection. Use an oscilloscope to monitor the output voltage and current, and check for signs of overheating. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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AP64102QSP-13 Overview

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