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AP64502QSP-13 - Diodes Incorporated

Description: Switching Voltage Regulators DCDC Conv HV Buck SO-8EP T&R 4K

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AP64502QSP-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8EP_2024_1
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AP64502QSP-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8EP_2024_1
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AP64502QSP-13 Details

  • Manufacturer Part Number:

    AP64502QSP-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • Additional Feature:

    PULSE FREQUENCY MODULATION TECHNIQUE ALSO AVAILABLE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.8 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5 A

  • Output Voltage-Max:

    40 V

  • Output Voltage-Min:

    0.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.63 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

AP64502QSP-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve placing thermal vias under the IC, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a 2-3 layer PCB with a thermal relief pattern on the top layer.
  • To ensure proper biasing, make sure to follow the recommended operating conditions in the datasheet. This includes setting the input voltage (VIN) within the specified range, using a suitable output capacitor, and ensuring the enable pin (EN) is properly driven. Additionally, consider using a soft-start circuit to prevent inrush currents during startup.
  • When selecting the output capacitor (COUT), consider the following factors: capacitance value, equivalent series resistance (ESR), and voltage rating. A higher capacitance value can help reduce output voltage ripple, but may increase the device's startup time. A low ESR capacitor can help reduce power losses, and the voltage rating should be higher than the maximum output voltage.
  • The AP64502QSP-13 has built-in overcurrent protection (OCP) and short-circuit protection (SCP). To handle these events, ensure that the device is properly configured and that the output is properly decoupled. In the event of an overcurrent or short-circuit condition, the device will automatically shut down and restart once the fault is removed.
  • Thermal management is critical for the AP64502QSP-13. Ensure good airflow around the device, and consider using a heat sink or thermal interface material (TIM) to improve heat dissipation. The device's junction temperature (TJ) should be kept below the maximum rating of 150°C to ensure reliable operation.

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