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APA150-TQG100I - Microchip

Description: ProASICPLUS Field Programmable Gate Array (FPGA) IC 66 36864 100-LQFP

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APA150-TQG100I - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - TQ(G)100
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APA150-TQG100I - Microchip  - 3D model - Quad Flat Packages - TQ(G)100
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APA150-TQG100I Details

  • Manufacturer Part Number:

    APA150-TQG100I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    LQFP-100

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.D

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    23

  • Clock Frequency-Max:

    180 MHz

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Equivalent Gates:

    150000

  • Number of Inputs:

    66

  • Number of Logic Cells:

    6144

  • Number of Outputs:

    66

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    150000 GATES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP100,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    2.7 V

  • Supply Voltage-Min:

    2.3 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 220 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

APA150-TQG100I Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the high-frequency signals away from the power plane and use a common mode choke to filter the power supply.
  • Use the lowest possible clock frequency, disable unused peripherals, and use the power-saving modes (e.g., sleep mode) when the device is not in use. Also, optimize the firmware to minimize switching activity.
  • The APA150-TQG100I can operate from -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal design and heat dissipation to prevent overheating.
  • Use a pull-up resistor on the CS pin, ensure proper signal termination, and use a clock frequency within the recommended range (typically 1-10 MHz). Also, implement error checking and handling mechanisms in the firmware.
  • Use 0.1 μF to 1 μF ceramic capacitors (e.g., X7R or X5R) as close to the power pins as possible. Add additional capacitors (e.g., 10 μF) for bulk decoupling, if necessary.

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APA150-TQG100I Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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