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APT100S20BG - Microsemi Corporation

Description: 120 A, 200 V, SILICON, RECTIFIER DIODE, TO-247

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PCB Footprints
APT100S20BG - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247
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3D Models
APT100S20BG - Microsemi Corporation  - 3D model - Transistor Outline, Vertical - TO-247
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APT100S20BG Details

  • Manufacturer Part Number:

    APT100S20BG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TO-247

  • Package Description:

    TO-247, 2 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    FREE WHEELING DIODE, SNUBBER DIODE, LOW LEAKAGE CURRENT, LOW NOISE, HIGH RELIABILITY

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e1

  • Non-rep Pk Forward Current-Max:

    1000 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    120 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.07 µs

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

APT100S20BG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 2 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Monitor the device's junction temperature, output voltage, and current. Implement over-temperature, over-voltage, and over-current protection mechanisms.
  • Yes, but ensure compliance with relevant industry standards (e.g., MIL-STD-883) and perform thorough testing and validation. Consult with Microsemi Corporation for specific guidance.
  • Use a shielded enclosure, keep sensitive components away from the APT100S20BG, and implement EMI filters or chokes as needed. Follow good PCB layout practices and use a common-mode choke.

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APT100S20BG Overview

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