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APT106N60LC6 - Microchip

Description: MOSFETs MOSFET COOLMOS 600 V 106 A TO-264

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APT106N60LC6 - Microchip PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-264 (L)
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APT106N60LC6 - Microchip  - 3D model - Transistor Outline, Vertical - TO-264 (L)
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  • Datasheet
  • Stock & Prices $ Price & Stock for APT106N60LC6
  • Part Number APT106N60LC6
  • Manufacturer Microchip
  • Pin Count 3
  • Part Category MOSFET (N-Channel)
  • Package Category Transistor Outline, Vertical
  • Footprint Name Transistor Outline, Vertical - TO-264 (L)
  • Released Date Nov 16, 2024
  • Last Modified Date Nov 16, 2024 7:00 AM UTC
  • Pinout / Pin List Click Here (Member Only)

APT106N60LC6 Details

  • Manufacturer Part Number:

    APT106N60LC6

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-264-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Avalanche Energy Rating (Eas):

    2200 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    600 V

  • Drain Current-Max (ID):

    106 A

  • Drain-source On Resistance-Max:

    0.035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    229 pF

  • JEDEC-95 Code:

    TO-264AA

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    833 W

  • Pulsed Drain Current-Max (IDM):

    318 A

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

APT106N60LC6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the APT106N60LC6 is -40°C to 150°C, as specified in the datasheet. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To ensure the APT106N60LC6 is properly biased, follow the recommended biasing scheme in the datasheet. This typically involves connecting the gate to a voltage source through a resistor, and ensuring the drain-source voltage is within the recommended range. Additionally, ensure the device is operated within the recommended current and power ratings.
  • For optimal performance and thermal management, it's recommended to follow a multi-layer PCB design with a solid ground plane, and to use thermal vias to dissipate heat from the device. Additionally, ensure the device is mounted on a heat sink or thermal pad, and that the PCB is designed to minimize thermal resistance.
  • To protect the APT106N60LC6 from overvoltage and overcurrent conditions, use a voltage regulator or overvoltage protection circuit to limit the voltage applied to the device. Additionally, use a current sense resistor and a current limiting circuit to prevent excessive current from flowing through the device.
  • The recommended gate drive circuit for the APT106N60LC6 typically involves using a gate driver IC or a discrete transistor to provide a high-current, low-impedance drive to the gate. The gate drive circuit should be designed to provide a fast rise and fall time, and to minimize ringing and oscillations.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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