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APT13F120B - Microchip

Description: MOSFET FREDFET MOS8 1200 V 13 A TO-247

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APT13F120B - Microchip - PCB symbol
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PCB Footprints
APT13F120B - Microchip PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - APT13F120B-
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APT13F120B - Microchip - 3D model - Transistor Outline, Vertical - APT13F120B-
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  • Datasheet
  • Stock & Prices $ Price & Stock for APT13F120B
  • Part Number APT13F120B
  • Manufacturer Microchip
  • Pin Count 3
  • Part Category MOSFET (N-Channel)
  • Package Category Transistor Outline, Vertical
  • Footprint Name Transistor Outline, Vertical - APT13F120B-
  • Released Date Mar 19, 2024
  • Last Modified Date Mar 19, 2024 5:28 AM UTC
  • Pinout / Pin List Click Here (Member Only)

APT13F120B Details

  • Manufacturer Part Number:

    APT13F120B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    TO-247-3

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    1070 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    14 A

  • Drain-source On Resistance-Max:

    1.2 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    625 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

APT13F120B Frequently Asked Questions (FAQs)

  • Microchip recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using a heat sink, and ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • The maximum allowed voltage on the input pins is 5.5V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the recommended operating range of 4.5V to 5.5V.
  • The APT13F120B has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-protected environment.
  • The recommended power-up sequence is to apply VCC first, followed by the input signals. This ensures that the internal voltage regulators are properly initialized and that the device operates correctly.

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APT13F120B Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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