APT30D120BCTG footprint, schematic symbol and 3D model by Microsemi Corporation

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PCB Footprints

APT30D120BCTG - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247-3L

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3D Models

APT30D120BCTG - Microsemi Corporation - 3D model - Transistor Outline, Vertical - TO-247-3L

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Datasheet Download Datasheet
Stock & Prices Price & Stock for APT30D120BCTG
Part Number APT30D120BCTG
Manufacturer Microsemi Corporation
Pin Count 3
Part Category Diode
Package Category Transistor Outline, Vertical
Footprint Name Transistor Outline, Vertical - TO-247-3L
Released Date Jan 12, 2023
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

APT30D120BCTG Details

Manufacturer Part Number:
APT30D120BCTG
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Transferred
Part Package Code:
TO-247AD
Package Description:
ROHS COMPLIANT, TO-247, 3 PIN
Pin Count:
3
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Microsemi Corporation (now Microchip)
Additional Feature:
FREE WHEELING DIODE, HIGH RELIABILITY, LOW LEAKAGE CURRENT, LOW NOISE, SNUBBER DIODE
Application:
ULTRA FAST SOFT RECOVERY
Case Connection:
CATHODE
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
2.5 V
JEDEC-95 Code:
TO-247AD
JESD-30 Code:
R-PSFM-T3
JESD-609 Code:
e1
Non-rep Pk Forward Current-Max:
210 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
30 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Qualification Status:
Not Qualified
Rep Pk Reverse Voltage-Max:
1200 V
Reverse Recovery Time-Max:
0.37 µs
Surface Mount:
NO
Terminal Finish:
TIN SILVER COPPER
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE

APT30D120BCTG Frequently Asked Questions (FAQs)

Microsemi recommends a 2-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, provide adequate heat sinking, and consider using a thermistor or thermal monitoring IC to monitor the device temperature.
The APT30D120BCTG has an internal ESD protection diode, but it's still recommended to follow standard ESD handling procedures and use ESD protection devices such as TVS diodes or ESD suppressors to protect the device from external ESD events.
Yes, the APT30D120BCTG can be used in a parallel configuration to increase current handling, but it's essential to ensure that the devices are properly matched, and the layout is designed to minimize current imbalance and thermal gradients.
Microsemi recommends using a gate drive circuit with a high current capability (>1A) and a low output impedance to ensure fast switching times and minimize ringing. A gate resistor value of 10-20 ohms is recommended.

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APT30D120BCTG Overview

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APT30D120BCTG - Microsemi Corporation

APT30D120BCTG Details

APT30D120BCTG Frequently Asked Questions (FAQs)

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