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APT60S20B2CTG - Microsemi Corporation

Description: Schottky Diodes & Rectifiers FG, SCHOTTKY, 200V, 60A, TO-247 T-MAX, RoHS

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APT60S20B2CTG - Microsemi Corporation - PCB symbol
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PCB Footprints
APT60S20B2CTG - Microsemi Corporation PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - T-MAX™ (B2)
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APT60S20B2CTG - Microsemi Corporation - 3D model - Transistor Outline, Vertical - T-MAX™ (B2)
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APT60S20B2CTG Details

  • Manufacturer Part Number:

    APT60S20B2CTG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    B2, TMAX-3

  • Pin Count:

    3

  • Manufacturer Package Code:

    B2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    FREE WHEELING DIODE, SNUBBER DIODE, HIGH RELIABILITY, LOW NOISE

  • Application:

    HIGH VOLTAGE ULTRA FAST SOFT RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.9 V

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e1

  • Non-rep Pk Forward Current-Max:

    600 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    60 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.065 µs

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

APT60S20B2CTG Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper heat sinking, use a thermally conductive material for the PCB, and consider using a thermal interface material (TIM) between the device and the heat sink. Also, follow the recommended operating conditions and derating guidelines.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • The APT60S20B2CTG is not specifically designed for radiation-hardened applications. However, Microsemi Corporation offers radiation-hardened versions of similar devices. Contact Microsemi for more information on their radiation-hardened product offerings.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 183°C 90s. For rework, use a low-temperature soldering iron and a thermal protection device to prevent overheating.

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APT60S20B2CTG Overview

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