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APTM50H15FT1G - Microsemi Corporation

Description: Discrete Semiconductor Modules DOR CC8031

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PCB Footprints
APTM50H15FT1G - Microsemi Corporation PCB footprint - Other - Other - APTM50H15FT1G-2
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3D Models
APTM50H15FT1G - Microsemi Corporation  - 3D model - Other - APTM50H15FT1G-2
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APTM50H15FT1G Details

  • Manufacturer Part Number:

    APTM50H15FT1G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT PACKAGE-12

  • Pin Count:

    12

  • ECCN Code:

    EAR99

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Additional Feature:

    AVALANCHE RATED

  • Case Connection:

    ISOLATED

  • Configuration:

    COMPLEX

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    25 A

  • Drain-source On Resistance-Max:

    0.156 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XUFM-X12

  • Number of Elements:

    4

  • Number of Terminals:

    12

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    208 W

  • Pulsed Drain Current-Max (IDM):

    135 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

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APTM50H15FT1G Overview

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