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AQHV24-01LTG - LITTELFUSE

Description: 52V Clamp 5A (8/20µs) Ipp Tvs Diode Surface Mount SOD-523

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PCB Footprints
AQHV24-01LTG - LITTELFUSE PCB footprint - Other - Other - SOD-523_10
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3D Models
AQHV24-01LTG - LITTELFUSE  - 3D model - Other - SOD-523_10
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AQHV24-01LTG Details

  • Manufacturer Part Number:

    AQHV24-01LTG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-523, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Date Of Intro:

    2018-11-26

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6.44

  • Breakdown Voltage-Min:

    26.7 V

  • Breakdown Voltage-Nom:

    28.7 V

  • Clamping Voltage-Max:

    52 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Peak Rev Power Dis-Max:

    250 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    0.05 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

AQHV24-01LTG Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow the PCB layout guidelines provided in the datasheet, including keeping the device away from heat sources, using thermal vias, and ensuring good airflow. Additionally, a thermal pad or heat sink can be used to improve heat dissipation.
  • To ensure proper soldering and avoid thermal damage, follow the recommended soldering profile provided in the datasheet, and use a soldering iron with a temperature-controlled tip. Avoid applying excessive heat or force during soldering, and ensure the device is properly secured to the PCB.
  • When using the AQHV24-01LTG in a high-reliability or safety-critical application, it is essential to follow the recommended design and testing guidelines, including performing thorough reliability testing, using redundant systems, and implementing fail-safe mechanisms. Additionally, consult with Littelfuse Inc or a qualified engineer to ensure the device meets the specific requirements of the application.
  • In a fault condition, the AQHV24-01LTG is designed to protect the circuit by limiting the current or voltage. The device will typically enter a fault state, and the output will be clamped to a safe level. However, it is essential to design the system to handle fault conditions and ensure the device is properly sized and protected to prevent damage or failure.
  • The AQHV24-01LTG's performance and reliability can be affected by environmental factors such as temperature, humidity, and vibration. Operating conditions such as input voltage, current, and frequency can also impact the device's performance. Ensure the device is operated within the recommended specifications and environmental conditions to maintain optimal performance and reliability.

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AQHV24-01LTG Overview

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