Description:Combined HDR RAW Output, up to 20−bit (>140 dB); Support for full−resolution 120 dB to 140 dB HDR+LFM; New High−Performance 3 um BSI Pixel with Super−Exposure HDR+LFM Mode; Advanced HDR Image Combination with Flexible Exposure Ratio Control; ASIL−B and Safety Design; Selectable Automatic or User Controlled Black Level Control; Spread−spectrum Input Clock Support; Real−time Functional Safety Mechanisms and Fault Detection; 1344 x 968 at up to 60fps; 2x2 In−pixel Binning; Data Interfaces: 4−lane MIPI CSI−2, P
Onsemi provides a recommended PCB layout and thermal management guide in their application note AND9456/D, which includes guidelines for thermal pad connection, PCB stack-up, and heat sink design.
To optimize performance in low-light conditions, adjust the exposure time, gain, and analog-to-digital converter (ADC) settings. Additionally, consider using onsemi's recommended noise reduction and image processing techniques, such as black level correction and temporal noise filtering.
The recommended operating temperature range for the AR0147ATSC00XUEG5-DRBR is -20°C to 70°C. However, it's essential to follow the thermal management guidelines to ensure the device stays within the specified temperature range to maintain optimal performance and reliability.
The AR0147ATSC00XUEG5-DRBR uses a 4-lane MIPI CSI-2 interface for data transmission. You'll need to design a compatible interface circuit and write firmware to configure the sensor and transmit data to the microcontroller or FPGA. Onsemi provides example code and design files to facilitate the integration process.
The latency of the AR0147ATSC00XUEG5-DRBR depends on the operating mode and output format. Typically, the latency is around 10-20 ms. To minimize the impact on system performance, consider using a double-buffering approach, where the sensor captures a new frame while the previous frame is being processed.
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AR0147ATSC00XUEG5-DRBR Overview
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