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AR0830CSSC11SMKA1-CP - onsemi

Description: Image Sensors Image Sensor, 8.3 MP, Rolling Shutter, Hyperlux LP 8.3MP 1/2.9", RGB, 11 deg CRA, CSP Package

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AR0830CSSC11SMKA1-CP - onsemi  - 3D model
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AR0830CSSC11SMKA1-CP Details

  • Manufacturer Part Number:

    AR0830CSSC11SMKA1-CP

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    ODCSP59 6.41x3.91x0.63, 0.50P

  • Package Description:

    CSP-59

  • Manufacturer Package Code:

    570AY

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    ELECTRONIC ROLLING SHUTTER, GLOBAL SHUTTER

  • Array Type:

    LINEAR

  • Body Breadth:

    3.914 mm

  • Body Height:

    0.631 mm

  • Body Length or Diameter:

    6.417 mm

  • Dynamic Range:

    100 dB

  • Frame Rate:

    60 fps

  • Horizontal Pixel:

    3840

  • Housing:

    GLASS

  • JESD-609 Code:

    e1

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Optical Format:

    1/2.9 inch

  • Output Interface Type:

    MIPI

  • Output Type:

    DIGITAL OUTPUT

  • Package Shape/Style:

    RECTANGULAR

  • Pixel Size:

    1.4X1.4 µm

  • Sensors/Transducers Type:

    IMAGE SENSOR,CMOS

  • Supply Voltage-Max:

    2.9 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Termination Type:

    SOLDER

  • Vertical Pixel:

    2160

AR0830CSSC11SMKA1-CP Frequently Asked Questions (FAQs)

  • Onsemi provides a recommended PCB layout and design guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal management, and electromagnetic compatibility.
  • To optimize power consumption, engineers can adjust the clock frequency, disable unused features, and use power-saving modes. Onsemi provides guidance on power management in their datasheet and application notes.
  • Onsemi provides a list of recommended lens and optical components in their datasheet or application notes. Engineers can also consult with onsemi's technical support or optical component manufacturers for customized solutions.
  • To ensure EMC and EMI compliance, engineers should follow onsemi's guidelines for PCB layout, component selection, and shielding. They should also perform EMC and EMI testing according to relevant industry standards.
  • Engineers should consider thermal management by providing adequate heat dissipation, using thermal pads or heat sinks, and ensuring good airflow around the camera module. Onsemi provides thermal management guidelines in their datasheet and application notes.

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AR0830CSSC11SMKA1-CP Overview

Use the download button to access the AR0830CSSC11SMKA1-CP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like AR083, or try a keyword search, such as Image Sensors

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