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AR8035-AL1A-R - Qualcomm

Description: IC TRANSCEIVER ETHERNET 40-QFN

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AR8035-AL1A-R - Qualcomm - PCB symbol
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PCB Footprints
AR8035-AL1A-R - Qualcomm PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - The AR8035 is packaged in a 40 pin QFN. The body size is 5 mm x 5 mm. The package
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3D Models
AR8035-AL1A-R - Qualcomm - 3D model - Quad Flat No-Lead - The AR8035 is packaged in a 40 pin QFN. The body size is 5 mm x 5 mm. The package
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AR8035-AL1A-R Details

  • Manufacturer Part Number:

    AR8035-AL1A-R

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-48

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Qualcomm

  • YTEOL:

    0

  • Data Rate:

    1000000 Mbps

  • JESD-30 Code:

    S-XQCC-N48

  • Length:

    5 mm

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Transceivers:

    1

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC48,.24SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max:

    113.7 mA

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    ETHERNET TRANSCEIVER

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

AR8035-AL1A-R Frequently Asked Questions (FAQs)

  • Qualcomm provides a recommended PCB layout guide for the AR8035-AL1A-R, which includes guidelines for component placement, routing, and thermal management. It's essential to follow this guide to ensure optimal performance and reliability.
  • To minimize power consumption, configure the AR8035-AL1A-R to use the lowest possible voltage and frequency settings. Additionally, use the device's power-saving features, such as dynamic voltage and frequency scaling, and enable low-power modes when possible.
  • The AR8035-AL1A-R has a maximum junction temperature of 125°C. Ensure good thermal conductivity between the device and the PCB, and use thermal pads or heat sinks if necessary. Keep the device away from heat sources and ensure good airflow around the PCB.
  • Use Qualcomm's debugging tools, such as the Qualcomm Debug Tool (QDT), to troubleshoot issues with the AR8035-AL1A-R. Also, consult the device's datasheet and application notes for troubleshooting guidelines and common error codes.
  • Follow Qualcomm's guidelines for EMI and EMC design considerations, including using shielding, filtering, and grounding techniques to minimize electromagnetic interference. Ensure the PCB layout and component placement meet EMI and EMC requirements.

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AR8035-AL1A-R Overview

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