Description:4-Side scalable arrays; Optional evaluation boards for are available for easy access to signals; Variety of formats ranging from 2×2 to 12×12; Minimal deadspace at the edges allowing tiling on all sides to allow the creation to still larger detection areas; Each array has either a multi-way connector or BGA on the reverse for access to all signals; The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor; The pixel-le
The recommended PCB layout and thermal management for optimal performance can be found in the application note AN5191, which provides guidelines for thermal design, PCB layout, and component placement.
To ensure reliable operation in high-temperature environments, it is recommended to follow the thermal design guidelines in the application note AN5191, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
The maximum allowable voltage on the input pins is 5.5V, as specified in the datasheet. Exceeding this voltage may damage the device.
The ARRAYC-30035-16P-PCB is not radiation-hardened and is not suitable for use in radiation-intensive environments. For radiation-hardened applications, onsemi offers other products that are specifically designed and tested for such environments.
The typical power consumption of the device is dependent on the operating frequency, input voltage, and output load. The datasheet provides power consumption estimates for different operating conditions, and the application note AN5191 provides more detailed information on power consumption and thermal design.
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ARRAYC-30035-16P-PCB Overview
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