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ARRAYC-60035-4P-BGA - onsemi

Description: 4-Side scalable arrays; Optional evaluation boards for are available for easy access to signals; Variety of formats ranging from 2×2 to 12×12; Minimal deadspace at the edges allowing tiling on all sides to allow the creation to still larger detection areas; Each array has either a multi-way connector or BGA on the reverse for access to all signals; The pixel signals can either be read out individually for imaging applications, or summed by the user to create a large area, single-channel sensor; The pixel-le

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ARRAYC-60035-4P-BGA - onsemi PCB footprint - Other - Other - ARRAYC-60035-4P-BGA-5
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ARRAYC-60035-4P-BGA - onsemi  - 3D model - Other - ARRAYC-60035-4P-BGA-5
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ARRAYC-60035-4P-BGA Details

  • Manufacturer Part Number:

    ARRAYC-60035-4P-BGA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    ARRAYC-600XX-4P-BGA

  • Manufacturer Package Code:

    100DG

  • Country Of Origin:

    Thailand

  • Factory Lead Time:

    35 Weeks

  • Manufacturer:

    onsemi

  • Optoelectronic Device Type:

    AVALANCHE PHOTODIODE

ARRAYC-60035-4P-BGA Frequently Asked Questions (FAQs)

  • The recommended PCB layout and thermal management for the ARRAYC-60035-4P-BGA can be found in the onsemi application note AND9005/D, which provides guidelines for thermal design, PCB layout, and component placement to ensure optimal performance and reliability.
  • The thermal shutdown feature in the ARRAYC-60035-4P-BGA is designed to protect the device from overheating. To handle this feature, ensure that your design includes a thermal monitoring circuit to detect when the device reaches its thermal shutdown temperature (typically 150°C). You can then use this signal to shut down the device or take other corrective action to prevent damage.
  • The recommended soldering process for the BGA package of the ARRAYC-60035-4P-BGA is a reflow soldering process with a peak temperature of 240°C to 250°C. It's essential to follow the onsemi recommended soldering profile and guidelines to ensure reliable connections and prevent damage to the device.
  • To ensure EMC in your design, follow the onsemi guidelines for electromagnetic interference (EMI) reduction, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as needed. Additionally, ensure that your design meets the relevant EMC standards and regulations for your application.
  • The recommended power sequencing and supply voltage for the ARRAYC-60035-4P-BGA can be found in the datasheet. Typically, the device requires a single 3.3V or 5V power supply, and the power sequencing should ensure that the voltage rails are powered up and down in a specific order to prevent damage to the device.

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ARRAYC-60035-4P-BGA Overview

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