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AS1C8M16PL-70BIN - Alliance Memory

Description: SRAM 128M 8Mx16 1.8V LP Pseudo SRAM IT

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PCB Footprints
AS1C8M16PL-70BIN - Alliance Memory PCB footprint - BGA - BGA - BGA49
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3D Models
AS1C8M16PL-70BIN - Alliance Memory  - 3D model - BGA - BGA49
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AS1C8M16PL-70BIN Details

  • Manufacturer Part Number:

    AS1C8M16PL-70BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FBGA-49

  • Country Of Origin:

    South Korea

  • ECCN Code:

    3A991.b.2.a

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

  • Access Time-Max:

    70 ns

  • I/O Type:

    COMMON

  • JESD-30 Code:

    S-PBGA-B49

  • Length:

    4 mm

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    PSEUDO STATIC RAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    49

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Organization:

    4MX16

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA49,7X7,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Seated Height-Max:

    1 mm

  • Standby Current-Max:

    0.00018 A

  • Standby Voltage-Min:

    1.7 V

  • Supply Current-Max:

    0.04 mA

  • Supply Voltage-Max (Vsup):

    1.95 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    4 mm

AS1C8M16PL-70BIN Frequently Asked Questions (FAQs)

  • The AS1C8M16PL-70BIN has an industrial temperature range of -40°C to +85°C, making it suitable for use in a wide range of applications.
  • The AS1C8M16PL-70BIN requires a controlled power-up and power-down sequence to prevent damage. It's recommended to follow the power-up sequence of VCC, then VPP, and power-down sequence of VPP, then VCC, with a minimum delay of 100ns between each step.
  • To minimize noise and ensure reliable operation, it's recommended to follow a controlled impedance PCB layout, with a solid ground plane, and to route the address and data lines as close as possible to the device. Additionally, decoupling capacitors should be placed close to the device's power pins.
  • The AS1C8M16PL-70BIN has a standby current of 10mA (typical) and a power consumption of 550mW (typical) when operating at 70ns. To minimize power consumption, it's recommended to use the device's standby mode when not in use, and to optimize the system's power management scheme.
  • The AS1C8M16PL-70BIN is designed to meet the EMC and EMI requirements of various industry standards, including IEC 61000-4-2 and IEC 61000-4-4. However, the actual EMC and EMI performance may vary depending on the system design and implementation.

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