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AS25F364MQ-10SIN - Alliance Memory

Description: NOR Flash 64Mb, 3.3V Serial NOR Flash, Multiple IO, Default Feature1, Industrial Grade, 8pin SOIC (209mils)

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PCB Footprints
AS25F364MQ-10SIN - Alliance Memory PCB footprint - Small Outline Packages - Small Outline Packages - SOP 8pin (209mil) Outline
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AS25F364MQ-10SIN - Alliance Memory  - 3D model - Small Outline Packages - SOP 8pin (209mil) Outline
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AS25F364MQ-10SIN Details

  • Manufacturer Part Number:

    AS25F364MQ-10SIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    6

  • Clock Frequency-Max (fCLK):

    104 MHz

  • JESD-30 Code:

    R-PDSO-G8

  • Memory Density:

    67108864 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    8388608 words

  • Number of Words Code:

    8000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Serial Bus Type:

    QSPI

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

AS25F364MQ-10SIN Frequently Asked Questions (FAQs)

  • The AS25F364MQ-10SIN has an industrial temperature range of -40°C to 85°C, making it suitable for use in a wide range of applications.
  • The AS25F364MQ-10SIN requires a controlled power-up and power-down sequence to prevent damage. It's recommended to follow the power-up sequence of VCC, then CE#, then OE#, and then WE#. For power-down, follow the reverse sequence.
  • The recommended PCB layout and land pattern for the AS25F364MQ-10SIN can be found in the Alliance Memory Inc. application note AN-001, which provides detailed guidelines for optimal board design and layout.
  • The AS25F364MQ-10SIN has a standby current of 10mA (typical) when CE# is high and OE# is high. To minimize power consumption, ensure that CE# is driven high and OE# is driven high during standby mode.
  • The AS25F364MQ-10SIN can be programmed and erased using a standard EPROM programmer or a dedicated programming socket. Follow the programming and erasing procedures outlined in the datasheet to ensure reliable operation.

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