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AS4C16M16S-7BCN - Alliance Memory

Description: Alliance Memory AS4C16M16S-7BCN, SDRAM 256Mbit Surface Mount, 143MHz, 3 → 3.6 V, 54-Pin TFBGA

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AS4C16M16S-7BCN - Alliance Memory PCB footprint - BGA - BGA - 54 Ball TFBGA
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AS4C16M16S-7BCN - Alliance Memory  - 3D model - BGA - 54 Ball TFBGA
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AS4C16M16S-7BCN Details

  • Manufacturer Part Number:

    AS4C16M16S-7BCN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, TFBGA-54

  • Pin Count:

    54

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.24

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

  • Access Mode:

    FOUR BANK PAGE BURST

  • Access Time-Max:

    5.4 ns

  • Additional Feature:

    AUTO/SELF REFRESH

  • JESD-30 Code:

    S-PBGA-B54

  • Length:

    8 mm

  • Memory Density:

    268435456 bit

  • Memory IC Type:

    SYNCHRONOUS DRAM

  • Memory Width:

    16

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    54

  • Number of Words:

    16777216 words

  • Number of Words Code:

    16000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    16MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.2 mm

  • Self Refresh:

    YES

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    8 mm

AS4C16M16S-7BCN Frequently Asked Questions (FAQs)

  • The AS4C16M16S-7BCN has an operating temperature range of 0°C to 70°C.
  • The datasheet recommends a slow and controlled power-up sequence to ensure proper initialization. It's also recommended to follow a specific power-down sequence to prevent data loss.
  • The AS4C16M16S-7BCN supports a maximum clock frequency of 7ns, which translates to a maximum clock speed of 143MHz.
  • The AS4C16M16S-7BCN does not have a built-in wait state feature. However, you can implement a wait state by inserting a NOP (no operation) cycle in your microcontroller or FPGA code.
  • The AS4C16M16S-7BCN is not designed for radiation-hardened applications. If you need a radiation-hardened SRAM, you should consider a different part number specifically designed for such applications.

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AS4C16M16S-7BCN Overview

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For a full list of alternate parts for AS4C16M16S-7BCN, check out Findchips.com