AS4C256M16D3LC-12BCN - Alliance Memory

AS4C256M16D3LC-12BCN Details

• Manufacturer Part Number:

  AS4C256M16D3LC-12BCN

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA, BGA96,9X16,32

• Reach Compliance Code:

  Compliant

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.36

• Factory Lead Time:

  6 Weeks

• Date Of Intro:

  2020-03-26

• Manufacturer:

  Alliance Memory Inc

• YTEOL:

  4

• Access Mode:

  MULTI BANK PAGE BURST

• Clock Frequency-Max (fCLK):

  800 MHz

• I/O Type:

  COMMON

• Interleaved Burst Length:

  4,8

• JESD-30 Code:

  R-PBGA-B96

• JESD-609 Code:

  e1

• Length:

  13.5 mm

• Memory Density:

  4294967296 bit

• Memory IC Type:

  DDR3L DRAM

• Memory Width:

  16

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Ports:

  1

• Number of Terminals:

  96

• Number of Words:

  268435456 words

• Number of Words Code:

  256000000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  95 °C

• Organization:

  256MX16

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA96,9X16,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Refresh Cycles:

  8192

• Seated Height-Max:

  1.2 mm

• Self Refresh:

  YES

• Sequential Burst Length:

  4,8

• Standby Current-Max:

  0.008 A

• Supply Current-Max:

  0.235 mA

• Supply Voltage-Max (Vsup):

  1.45 V

• Supply Voltage-Min (Vsup):

  1.283 V

• Supply Voltage-Nom (Vsup):

  1.35 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  7.5 mm