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AS5F32G04SND-08LIN - Alliance Memory

Description: NAND Flash

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AS5F32G04SND-08LIN - Alliance Memory PCB footprint - Small Outline No-lead - Small Outline No-lead - AS5F32G04SND-08LIN
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AS5F32G04SND-08LIN - Alliance Memory  - 3D model - Small Outline No-lead - AS5F32G04SND-08LIN
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AS5F32G04SND-08LIN Details

  • Manufacturer Part Number:

    AS5F32G04SND-08LIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LGA-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2020-07-14

  • Manufacturer:

    Alliance Memory Inc

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    120 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    60000 Write/Erase Cycles

  • JESD-30 Code:

    R-XDSO-N8

  • Length:

    8 mm

  • Memory Density:

    2147483648 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    268435456 words

  • Number of Words Code:

    256000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    0.8 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00012 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Width:

    6 mm

  • Write Protection:

    HARDWARE

AS5F32G04SND-08LIN Frequently Asked Questions (FAQs)

  • The AS5F32G04SND-08LIN has an industrial temperature range of -40°C to 85°C, making it suitable for a wide range of applications.
  • The device requires a controlled power-up and power-down sequence to prevent latch-up and ensure proper operation. A slow ramp-up and ramp-down of the power supply voltage is recommended, with a maximum slew rate of 10 mV/μs.
  • To minimize noise and ensure signal integrity, it is recommended to follow a controlled impedance PCB layout and routing, with a solid ground plane and decoupling capacitors placed close to the device.
  • The device requires a stable clock signal with a maximum jitter of 100 ps. Clock domain crossing should be handled using a clock domain crossing circuit or a FIFO buffer to ensure data integrity.
  • The device should be tested using a combination of functional and parametric tests, including memory access patterns, data retention, and power consumption measurements. Validation should be performed using a test fixture and a protocol analyzer or a logic analyzer.

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