ASDMB-19.200MHZ-XY-T footprint, schematic symbol and 3D model by ABRACON

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ASDMB-19.200MHZ-XY-T Details

Manufacturer Part Number:
ASDMB-19.200MHZ-XY-T
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
ROHS COMPLIANT, ULTRA MINIATURE, PLASTIC, QFN-4
Country Of Origin:
Thailand
ECCN Code:
EAR99
Factory Lead Time:
8 Weeks
Manufacturer:
Abracon Corporation
YTEOL:
6
Additional Feature:
TRI-STATE; STANDBY; ENABLE/DISABLE FUNCTION; TR; SUPPLY VOLTAGE 1.8V AND 2.5V ALSO AVAILLABLE
Fall Time-Max:
2 ns
Frequency Adjustment-Mechanical:
NO
Frequency Stability:
10%
JESD-609 Code:
e4
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
4
Operating Frequency-Nom:
19.2 MHz
Operating Temperature-Max:
105 °C
Operating Temperature-Min:
-40 °C
Oscillator Type:
CMOS
Output Load:
15 pF
Package Body Material:
PLASTIC/EPOXY
Physical Dimension:
2.5mm x 2.0mm x 0.85mm
Rise Time-Max:
2 ns
Supply Voltage-Max:
3.3 V
Supply Voltage-Min:
1.8 V
Surface Mount:
YES
Symmetry-Max:
55/45 %
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)

Abracon recommends a soldering temperature profile with a peak temperature of 240°C to 250°C, with a dwell time of 1-2 seconds. This ensures reliable solder joints and minimizes thermal stress on the component.
Handle ASDMB-19.200MHZ-XY-T by the package body, avoiding touching the pins or electrical contacts. Store the components in their original packaging, away from direct sunlight, moisture, and extreme temperatures.
The ASDMB-19.200MHZ-XY-T is rated for operation from -40°C to +85°C. Operating the component outside this range may affect its performance, reliability, or lifespan.
While ASDMB-19.200MHZ-XY-T is designed to withstand normal handling and mounting stresses, it's not recommended for high-vibration environments (e.g., aerospace, industrial machinery). For such applications, consider using components specifically designed for high-vibration environments.
Abracon provides a recommended PCB land pattern and layout guidelines in their application notes or datasheet. Follow these guidelines to ensure reliable assembly, minimize thermal stress, and optimize signal integrity.

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