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ASFC128G32T5-51BIN - Alliance Memory

Description: eMMC eMMC 128GB, 3V, (TLC Gen5 NAND),Industrial Temp,153ball FBGA (11.5x13mm)-Tray Fully compliant with JEDEC e·MMC 5.1 Standard (JESD84-B51) • 153-ball BGA, 0.5mm pitch, 11.5 x 13mm, RoHS compliant • 3D TLC NAND base technology • Multiple 3D TLC or enhanced/reliable mode partitions user configurable according to e·MMC Spec 5.1 • High performance e·MMC 5.1 specification o Eleven-wire bus (clock, Data Strobe, 1 bit command, 8 bit data bus) and a hardware reset o Three different data bus width modes: 1

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ASFC128G32T5-51BIN - Alliance Memory PCB footprint - BGA - BGA - 153ball FBGA..
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3D Models
ASFC128G32T5-51BIN - Alliance Memory  - 3D model - BGA - 153ball FBGA..
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ASFC128G32T5-51BIN Details

  • Manufacturer Part Number:

    ASFC128G32T5-51BIN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Alliance Memory Inc

  • Memory IC Type:

    eMMC

ASFC128G32T5-51BIN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the ASFC128G32T5-51BIN is 0°C to 85°C.
  • Yes, the ASFC128G32T5-51BIN is RoHS (Restriction of Hazardous Substances) compliant, meaning it meets the European Union's directive on the restriction of certain hazardous substances in electrical and electronic equipment.
  • The refresh rate of the ASFC128G32T5-51BIN is 3.9 μs at 85°C, and 7.8 μs at 0°C to 70°C.
  • Yes, the ASFC128G32T5-51BIN is designed to operate with a 3.3V power supply (VDD) and a 2.5V power supply (VDDQ) for the I/O interface.
  • The latency of the ASFC128G32T5-51BIN is 5 clock cycles (CL5) for read and write operations.

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