ASMPH-0603-R68M-T footprint, schematic symbol and 3D model by ABRACON

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ASMPH-0603-R68M-T Details

The recommended land pattern for the ASMPH-0603-R683M-T is a rectangular pad with a size of 0.6mm x 0.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
The ASMPH-0603-R68M-T is rated for operation up to 125°C, but it's not recommended for use in high-temperature applications above 150°C. If your application requires operation above 150°C, you should consider using a different component or consulting with Abracon Corporation for a custom solution.
Yes, the ASMPH-0603-R68M-T is compatible with lead-free soldering processes. It is designed to meet the requirements of the RoHS directive and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
The maximum power rating of the ASMPH-0603-R68M-T is 0.25W. It's essential to ensure that the component is operated within this power rating to prevent overheating and damage.
The ASMPH-0603-R68M-T is designed for general-purpose use and is not optimized for high-frequency applications. If your application requires operation above 100MHz, you should consider using a different component or consulting with Abracon Corporation for a custom solution.

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