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ASPI-0403-6R8M-T - ABRACON

Description: Unshielded Wirewound Inductors, 6.8uh, ±20%, 0.1312?, 0.95a, Surface Mount , 4.5 x 4.0 x 3.2m

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Symbol
ASPI-0403-6R8M-T - ABRACON - PCB symbol
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PCB Footprints
ASPI-0403-6R8M-T - ABRACON PCB footprint - Other - Other - ASPI-0403-3R3M-T-2
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ASPI-0403-6R8M-T Details

  • Manufacturer Part Number:

    ASPI-0403-6R8M-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    ROHS COMPLIANT

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    6.6

  • Case/Size Code:

    1816

  • Construction:

    Chip

  • Core Material:

    Non-Specified

  • DC Resistance:

    0.1312 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3.2 mm

  • Package Length:

    4.5 mm

  • Package Style:

    SMT

  • Package Width:

    4 mm

  • Packing Method:

    TR

  • Rated Current-Max:

    0.95 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    20%

ASPI-0403-6R8M-T Frequently Asked Questions (FAQs)

  • Abracon recommends a land pattern with a pad size of 0.55mm x 0.55mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
  • While the ASPI-0403-6R8M-T is rated for operation up to 125°C, it's essential to consider the derating curves and thermal management to ensure reliable operation in high-temperature environments. Consult with Abracon's application engineers for specific guidance.
  • Handle the component by the edges, avoid touching the pads, and use ESD protection during assembly. Ensure the PCB is clean and dry before assembly, and follow standard SMT assembly procedures.
  • Abracon recommends a soldering profile with a peak temperature of 240°C ± 5°C, a dwell time above 217°C of 30-60 seconds, and a cooling rate of 3-6°C/second to ensure reliable solder joints.
  • While the ASPI-0403-6R8M-T is designed to be robust, it's essential to consider the specific vibration and shock requirements of your application. Consult with Abracon's application engineers to determine the suitability of the component for your specific use case.

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ASPI-0403-6R8M-T Overview

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