ASPI-0602S-3R0M-T footprint, schematic symbol and 3D model by ABRACON

Symbol

PCB Footprints

ASPI-0602S-3R0M-T Details

Abracon recommends a land pattern with a pad size of 0.65mm x 0.65mm and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
Yes, the ASPI-0602S-3R0M-T is rated for operation up to 125°C, making it suitable for high-temperature applications. However, the operating temperature range may affect the component's performance and lifespan.
Handle the component by the edges to prevent damage to the termination pads. Avoid touching the component's body or termination pads to prevent electrostatic discharge (ESD) damage. Use ESD-safe handling and storage procedures to ensure the component's reliability.
Abracon recommends a soldering profile with a peak temperature of 260°C ± 5°C, a dwell time above 220°C of 30-60 seconds, and a cooling rate of 4°C/second or less to ensure reliable soldering and minimize thermal stress.
Yes, the ASPI-0602S-3R0M-T is designed to withstand high-vibration and high-shock environments. However, the component's performance and reliability may be affected by extreme vibration or shock levels. Consult Abracon's application notes for more information on vibration and shock testing.

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