ASPI-1367-3R3M-T footprint, schematic symbol and 3D model by ABRACON

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ASPI-1367-3R3M-T Details

Abracon recommends a land pattern with a pad size of 1.3mm x 0.8mm, and a non-solder mask defined (NSMD) pad shape to ensure reliable soldering and minimize thermal resistance.
Yes, the ASPI-1367-3R3M-T is designed to withstand vibrations up to 20G, making it suitable for use in harsh environments. However, it's essential to ensure proper mounting and soldering to prevent mechanical stress.
Abracon recommends a peak reflow temperature of 260°C, with a dwell time of 30-60 seconds above 220°C. Ensure that the component is properly centered on the PCB and that the solder paste is evenly distributed to prevent thermal damage.
Yes, the ASPI-1367-3R3M-T is RoHS-compliant and compatible with lead-free soldering processes. However, it's essential to follow the recommended reflow profile and ensure that the soldering process is optimized for lead-free solders.
The typical power dissipation of the ASPI-1367-3R3M-T is around 1.5W, but this can vary depending on the specific application and operating conditions. Ensure that the component is properly heat-sinked and that the PCB is designed to dissipate heat efficiently.

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