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ASPIAIG-F7030-3R3M-T - ABRACON

Description: 3.3 µH Shielded Molded Inductor 10 A 18mOhm Max Nonstandard

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ASPIAIG-F7030-3R3M-T - ABRACON PCB footprint - Other - Other - 7.8*7.6*2.9mm_2023-2
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ASPIAIG-F7030-3R3M-T - ABRACON  - 3D model - Other - 7.8*7.6*2.9mm_2023-2
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ASPIAIG-F7030-3R3M-T Details

  • Manufacturer Part Number:

    ASPIAIG-F7030-3R3M-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Abracon Corporation

  • YTEOL:

    7

  • Case/Size Code:

    3130

  • Construction:

    Molded

  • Core Material:

    ALLOY POWDER

  • DC Resistance:

    0.018 Ω

  • Inductance-Nom (L):

    3.3 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    2.9 mm

  • Package Length:

    7.8 mm

  • Package Style:

    SMT

  • Package Width:

    7.6 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    10 A

  • Reference Standard:

    AEC-Q200; TS16949

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

ASPIAIG-F7030-3R3M-T Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ASPIAIG-F7030-3R3M-T can be found in the Abracon Corporation's application note AN-03, which provides guidelines for PCB layout and land pattern design.
  • To prevent damage, it is recommended to handle the ASPIAIG-F7030-3R3M-T by the edges, avoid touching the pads or components, and use anti-static wrist straps or mats during assembly.
  • The thermal resistance of the ASPIAIG-F7030-3R3M-T is not explicitly stated in the datasheet, but it can be estimated to be around 20-30°C/W, depending on the PCB design and thermal management. For more accurate information, contact Abracon Corporation's technical support.
  • The ASPIAIG-F7030-3R3M-T is designed to meet the requirements of various industries, including automotive and industrial, which often involve high-vibration environments. However, it is recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
  • The recommended soldering profile for the ASPIAIG-F7030-3R3M-T is a standard reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds. However, it is recommended to consult the Abracon Corporation's application note AN-01 for more detailed information on soldering and assembly.

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ASPIAIG-F7030-3R3M-T Overview

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