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AT25M02-SSHM-T - Microchip

Description: memory

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AT25M02-SSHM-T - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
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3D Models
AT25M02-SSHM-T - Microchip  - 3D model - Small Outline Packages - 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC)
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AT25M02-SSHM-T Details

  • Manufacturer Part Number:

    AT25M02-SSHM-T

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOIC-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    18

  • Clock Frequency-Max (fCLK):

    5 MHz

  • Data Retention Time-Min:

    100

  • Endurance:

    1000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Memory Density:

    2097152 bit

  • Memory IC Type:

    EEPROM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Ports:

    1

  • Number of Terminals:

    8

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.23

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    1.8 V

  • Seated Height-Max:

    1.75 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.000003 A

  • Supply Current-Max:

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Supply Voltage-Nom (Vsup):

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    5 ms

  • Write Protection:

    HARDWARE

AT25M02-SSHM-T Frequently Asked Questions (FAQs)

  • The AT25M02-SSHM-T has a minimum of 100,000 write cycles, but the actual number of write cycles may vary depending on the usage and operating conditions.
  • To handle page write buffer overflow, you can use the 'Ready/Busy' pin to monitor the device's status. When the buffer is full, the device will set the 'Ready/Busy' pin low, indicating that it is busy writing data. You can then wait until the pin goes high again before sending more data.
  • The recommended power-up sequence for the AT25M02-SSHM-T is to apply VCC first, followed by the clock signal (SCK). This ensures that the device is properly initialized and ready for operation.
  • To implement data retention in the AT25M02-SSHM-T, you can use the device's built-in data retention feature. This feature allows the device to retain data even when power is removed. To enable data retention, you need to write the retention register (0x03) with the value 0x01.
  • The maximum clock frequency for the AT25M02-SSHM-T is 20 MHz. However, the actual clock frequency may vary depending on the specific application and operating conditions.

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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