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ATB2012E-50012M-T01 - TDK

Description: Signal Conditioning 0.5ohms 150mA 20VDC Wound Chip Balun

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ATB2012E-50012M-T01 - TDK - PCB symbol
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PCB Footprints
ATB2012E-50012M-T01 - TDK PCB footprint - Other - Other - ATB2012E-50012M-T01-1
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3D Models
ATB2012E-50012M-T01 - TDK - 3D model - Other - ATB2012E-50012M-T01-1
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ATB2012E-50012M-T01 Details

  • Manufacturer Part Number:

    ATB2012E-50012M-T01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Cut-off Frequency-Min:

    400 MHz

  • Height:

    1 mm

  • Input Voltage-Nom:

    20 V

  • Insertion Loss:

    2.5 dB

  • Length:

    2 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TR, 7 INCH

  • Surface Mount:

    YES

  • Transformer Type:

    RF TRANSFORMER

  • Width:

    1.2 mm

ATB2012E-50012M-T01 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ATB2012E-50012M-T01 can be found in the TDK Corporation's application note or in the IPC-7351 standard. It is essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • Handle the ATB2012E-50012M-T01 by the edges to prevent damage to the component. Avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage. Use an anti-static wrist strap or mat to discharge static electricity.
  • The maximum storage temperature for the ATB2012E-50012M-T01 is 40°C (104°F) according to the datasheet. Storing the component above this temperature may affect its reliability and performance.
  • The ATB2012E-50012M-T01 is designed to withstand moderate vibration. However, it is essential to evaluate the component's performance in a high-vibration environment through rigorous testing and simulation. Consult with TDK Corporation's application engineers for guidance on using the component in high-vibration applications.
  • Use a soldering iron with a temperature of 250°C (482°F) to 270°C (518°F) and a solder with a melting point of 217°C (423°F) to 221°C (430°F). Apply a small amount of solder to the component's leads and the PCB pads. Avoid overheating the component or the PCB.

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ATB2012E-50012M-T01 Overview

Use the download button to access the ATB2012E-50012M-T01 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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