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ATECC608A-MAHHL-S - Microchip

Description: Microchip CryptoAuthentication™ Device

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PCB Footprints
ATECC608A-MAHHL-S - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]-1
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3D Models
ATECC608A-MAHHL-S - Microchip  - 3D model - Small Outline No-lead - 8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (Q4B) - 2x3 mm Body [UDFN]-1
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ATECC608A-MAHHL-S Details

  • Manufacturer Part Number:

    ATECC608A-MAHHL-S

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    UDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    3

  • Bus Compatibility:

    I2C, UART

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    3 mm

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.11X.07,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    2 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

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ATECC608A-MAHHL-S Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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