The recommended land pattern for ATFC-0402-1N0B-T is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad. The pad should be centered on the component.
The thermal resistance of ATFC-0402-1N0B-T is approximately 150°C/W. This value is not explicitly stated in the datasheet, but it can be estimated based on the package size and material.
Yes, ATFC-0402-1N0B-T is compatible with lead-free soldering. The component is RoHS compliant and can be soldered using lead-free solder alloys such as SAC305.
The maximum operating temperature of ATFC-0402-1N0B-T is 125°C. This is the maximum temperature at which the component is guaranteed to meet its electrical specifications.
Yes, ATFC-0402-1N0B-T can be used in high-frequency applications up to 1 GHz. The component has a low equivalent series resistance (ESR) and a high self-resonant frequency, making it suitable for high-frequency circuits.
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ATFC-0402-1N0B-T Overview
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