The recommended land pattern for the ATFC-0402-1N2B-T is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a clearance of at least 0.1mm from the component body.
During reflow soldering, the ATFC-0402-1N2B-T should be placed on a flat, even surface to prevent warping or bending. The component should be aligned with the PCB pads and secured with a small amount of solder paste. The reflow temperature profile should follow the recommended soldering conditions, with a peak temperature of 260°C and a dwell time of 30-60 seconds.
The maximum operating temperature range for the ATFC-0402-1N2B-T is -40°C to +125°C. However, the component's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
The ATFC-0402-1N2B-T is designed to withstand moderate vibration levels, but it may not be suitable for high-vibration environments. If your application requires the component to operate in a high-vibration environment, you should consult with Abracon Corporation or perform additional testing to ensure the component's reliability.
The ATFC-0402-1N2B-T should be stored in a dry, cool place, away from direct sunlight and moisture. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption. If the component is exposed to moisture, it should be baked in a dry oven at 125°C for 24 hours before use.
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ATFC-0402-1N2B-T Overview
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