ATFC-0402-1N4B-T - ABRACON

ATFC-0402-1N4B-T Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the ATFC-0402-1N4B-T?
  The recommended land pattern for the ATFC-0402-1N4B-T is a rectangular pad with a size of 0.5mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
• How do I handle the ATFC-0402-1N4B-T during reflow soldering?
  During reflow soldering, the ATFC-0402-1N4B-T should be placed on a flat, even surface to prevent warping or tombstoning. The component should be centered on the pad and the solder paste should be evenly distributed. The recommended reflow profile is a peak temperature of 260°C with a dwell time of 30-60 seconds.
• Is the ATFC-0402-1N4B-T compatible with lead-free soldering?
  Yes, the ATFC-0402-1N4B-T is compatible with lead-free soldering. The component is RoHS compliant and can withstand the higher temperatures required for lead-free soldering.
• What is the maximum operating temperature of the ATFC-0402-1N4B-T?
  The maximum operating temperature of the ATFC-0402-1N4B-T is 125°C. However, the component can withstand storage temperatures up to 150°C.
• How do I store the ATFC-0402-1N4B-T to prevent moisture damage?
  The ATFC-0402-1N4B-T should be stored in a dry, cool place with a relative humidity of less than 60%. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.