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ATP112-TL-H - onsemi

Description: ON Semiconductor ATP112-TL-H P-channel MOSFET Transistor, 25 A, -25 V, 3-Pin ATPAK

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Symbol
ATP112-TL-H - onsemi - PCB symbol
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PCB Footprints
ATP112-TL-H - onsemi PCB footprint - Other - Other - DPAK (Single Gauge) / ATPAK CASE 369AM ISSUE O_1
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3D Models
ATP112-TL-H - onsemi - 3D model - Other - DPAK (Single Gauge) / ATPAK CASE 369AM ISSUE O_1
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ATP112-TL-H Details

  • Manufacturer Part Number:

    ATP112-TL-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    3

  • Manufacturer Package Code:

    369AM

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    25 A

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    40 W

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Time@Peak Reflow Temperature-Max (s):

    30

ATP112-TL-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Monitor the device's junction temperature (TJ) and adjust the system design accordingly.
  • Exceeding the maximum TJ rating can lead to reduced lifespan, decreased performance, and potential device failure. Ensure the system design keeps TJ within the recommended range (typically 150°C for the ATP112-TL-H).
  • Implement proper ESD protection measures, such as using ESD-sensitive handling procedures, and consider adding external protection devices (e.g., TVS diodes) to the circuit. Ensure the PCB design includes adequate clearance and creepage distances.
  • Follow the onsemi recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds, and a maximum of 3 reflow cycles. For rework, use a low-temperature soldering iron (below 350°C) and a solder with a melting point below 217°C.

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ATP112-TL-H Overview

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