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ATP114-TL-H - onsemi

Description: ON SEMICONDUCTOR - ATP114-TL-H. - MOSFET, P-CH, -60V, -55A, ATPAK-3

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PCB Footprints
ATP114-TL-H - onsemi PCB footprint - Other - Other - DPAK (Single Gauge) / ATPAK CASE 369AM ISSUE O_1
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3D Models
ATP114-TL-H - onsemi  - 3D model - Other - DPAK (Single Gauge) / ATPAK CASE 369AM ISSUE O_1
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ATP114-TL-H Details

  • Manufacturer Part Number:

    ATP114-TL-H

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN AND LEAD FREE, ATPAK-3/2

  • Pin Count:

    3

  • Manufacturer Package Code:

    369AM

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    100 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    55 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    60 W

  • Pulsed Drain Current-Max (IDM):

    165 A

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

ATP114-TL-H Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a heat sink or thermal interface material, and ensure good airflow. Monitor the device's junction temperature (TJ) and adjust the thermal design accordingly.
  • Use a human body model (HBM) ESD protection circuit with a minimum of 2 kV rating. Ensure the protection circuit is placed close to the device and connected to a solid ground plane.
  • Yes, the ATP114-TL-H is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure you follow the recommended design and testing guidelines for these applications.
  • Use a logic analyzer or oscilloscope to monitor the device's inputs and outputs. Check for proper power supply, decoupling, and signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.

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