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ATSAMD21E17L-AF - Microchip

Description: MCU 32-bit ARM Cortex M0+ RISC 128KB Flash 3.3V 32-Pin TQFP Tray

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ATSAMD21E17L-AF - Microchip PCB footprint - Quad Flat Packages - Quad Flat Packages - 32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
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ATSAMD21E17L-AF - Microchip  - 3D model - Quad Flat Packages - 32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
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ATSAMD21E17L-AF Details

  • Manufacturer Part Number:

    ATSAMD21E17L-AF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TQFP-32

  • Pin Count:

    32

  • Manufacturer Package Code:

    TQFP-32

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    19

  • Has ADC:

    YES

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    Cortex-M0+

  • Clock Frequency-Max:

    32 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-PQFP-G32

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    12

  • Number of External Interrupts:

    16

  • Number of I/O Lines:

    26

  • Number of Serial I/Os:

    4

  • Number of Terminals:

    32

  • Number of Timers:

    6

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TQFP

  • Package Equivalence Code:

    TQFP32,.35SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    16384

  • RAM (words):

    16384

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.2 mm

  • Speed:

    48 MHz

  • Supply Current-Max:

    4.7 mA

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

ATSAMD21E17L-AF Frequently Asked Questions (FAQs)

  • The ATSAMD21E17L-AF has an operating temperature range of -40°C to +85°C, but it can be extended to -40°C to +105°C with some limitations on the clock frequency and voltage supply.
  • The clock system on the ATSAMD21E17L-AF can be configured using the System Clock Control (CLK) module. You need to select the clock source (e.g., internal oscillator, external crystal, or PLL), set the clock frequency, and configure the clock prescalers and dividers. Refer to the device's datasheet and the Microchip ASF (Atmel Software Framework) documentation for more information.
  • The maximum current consumption of the ATSAMD21E17L-AF depends on the operating frequency, voltage supply, and peripheral usage. According to the datasheet, the maximum current consumption is around 150 mA at 3.3V and 48 MHz. However, this value can be reduced by optimizing the clock frequency, voltage supply, and peripheral usage.
  • The DMA controller on the ATSAMD21E17L-AF allows for efficient data transfer between peripherals and memory. To use the DMA controller, you need to configure the DMA channel, set the transfer mode, and enable the DMA interrupt. You can refer to the device's datasheet and the Microchip ASF documentation for more information and example code.
  • The main difference between the ATSAMD21E17L-AF and the ATSAMD21G17L-AF is the package type. The ATSAMD21E17L-AF comes in a 48-pin QFN package, while the ATSAMD21G17L-AF comes in a 48-pin TQFP package. Both devices have the same features and specifications, but the QFN package is more suitable for surface-mount technology (SMT) assembly, while the TQFP package is more suitable for through-hole assembly.

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ATSAMD21E17L-AF Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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