ATSAMV70N20B-CB - Microchip

ATSAMV70N20B-CB Details

• Manufacturer Part Number:

  ATSAMV70N20B-CB

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TFBGA-100

• Pin Count:

  100

• Manufacturer Package Code:

  TFBGA-100

• Country Of Origin:

  Taiwan

• ECCN Code:

  5A992.C

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  10 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  18

• Has ADC:

  YES

• Bit Size:

  32

• Boundary Scan:

  YES

• CPU Family:

  CORTEX-M7

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  YES

• DMA Channels:

  YES

• Format:

  FLOATING POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PBGA-B100

• Length:

  9 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of DMA Channels:

  24

• Number of I/O Lines:

  100

• Number of Serial I/Os:

  10

• Number of Terminals:

  100

• Number of Timers:

  12

• On Chip Data RAM Width:

  32

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA100,10X10,32

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Packing Method:

  TRAY

• RAM (bytes):

  393216

• RAM (words):

  98304

• ROM (words):

  1048576

• ROM Programmability:

  FLASH

• Screening Level:

  AEC-Q100; TS 16949

• Seated Height-Max:

  1.1 mm

• Speed:

  300 MHz

• Supply Voltage-Max:

  1.32 V

• Supply Voltage-Min:

  1.2 V

• Supply Voltage-Nom:

  1.25 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  9 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC