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AUIR3241STR - Infineon

Description: INFINEON - AUIR3241STR - MOSFET Driver, High Side, 3V To 36V Supply, Back To Back, Low Iq, SOIC-8

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AUIR3241STR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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AUIR3241STR - Infineon  - 3D model - Small Outline Packages - SO-8
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AUIR3241STR Details

  • Manufacturer Part Number:

    AUIR3241STR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    9

  • High Side Driver:

    YES

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    STANDARD

  • Output Peak Current Limit-Nom:

    0.35 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    36 mA

  • Supply Voltage-Max:

    36 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    5 µs

  • Turn-on Time:

    3 µs

  • Width:

    3.9 mm

AUIR3241STR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a metal plate to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermistor or thermocouple to monitor the device temperature.
  • Monitor the device temperature, output current, and input voltage. Implement over-temperature protection (OTP), over-current protection (OCP), and under-voltage lockout (UVLO) to ensure safe operation.
  • Use the device's low-power mode, reduce the switching frequency, and optimize the output voltage and current. Also, consider using a power-saving mode or shutdown mode when the device is not in use.
  • Use a low-ESR capacitor (e.g., X7R or X5R) with a value between 10uF to 22uF, and a low-inductance resistor (e.g., 10mΩ to 22mΩ) in series with the capacitor.

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Manufacturer Collaborated
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AUIR3241STR Overview

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