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AUIRF7379QTR - Infineon

Description: MOSFET AUTO 30V 1 N-CH HEXFET 45mOhms

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AUIRF7379QTR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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AUIRF7379QTR Details

  • Manufacturer Part Number:

    AUIRF7379QTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED, HIGH RELIABILITY, ULTRA-LOW RESISTANCE

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4.8 A

  • Drain-source On Resistance-Max:

    0.045 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    46 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

AUIRF7379QTR Frequently Asked Questions (FAQs)

  • Infineon provides a reference design and layout guidelines in their application notes and evaluation boards. It's essential to follow these guidelines to ensure optimal thermal performance and minimize electromagnetic interference (EMI).
  • The gate drive circuit should be designed to provide a fast rise and fall time, low impedance, and sufficient current capability. Infineon recommends using a dedicated gate driver IC, such as the Infineon 1EDF7171, and following their application notes for optimal design.
  • Monitor the device's junction temperature, drain-source voltage, and current. Implement over-temperature protection, over-current protection, and under-voltage lockout to ensure reliable operation and prevent damage.
  • Follow Infineon's guidelines for PCB layout, use a shielded enclosure, and implement EMI filters and shielding to minimize electromagnetic radiation. Ensure that the design meets the relevant EMC standards and regulations.
  • Infineon provides test and validation procedures in their application notes and datasheet. Perform static and dynamic testing, including characterization of the device's electrical parameters, and validate the design using simulation tools and prototyping.

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AUIRF7379QTR Overview

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Part Image IRF7379QPBF International Rectifier

Power Field-Effect Transistor, 5.8A I(D), 30V, 0.045ohm, 2-Element, N-Channel and P-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA