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AUIRF9Z34N - Infineon

Description: MOSFET P-Channel 55V 19A TO220AB Infineon AUIRF9Z34N P-channel MOSFET Transistor, 19 A, 55 V, 3-Pin TO-220AB

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PCB Footprints
AUIRF9Z34N - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO220AB_3
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3D Models
AUIRF9Z34N - Infineon  - 3D model - Transistor Outline, Vertical - TO220AB_3
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AUIRF9Z34N Details

  • Manufacturer Part Number:

    AUIRF9Z34N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED, HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    180 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    19 A

  • Drain-source On Resistance-Max:

    0.1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    68 W

  • Pulsed Drain Current-Max (IDM):

    68 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

AUIRF9Z34N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the AUIRF9Z34N is -40°C to 150°C.
  • Proper cooling can be achieved by using a heat sink, ensuring good airflow, and keeping the device away from other heat sources.
  • A recommended PCB layout for minimizing EMI includes using a solid ground plane, keeping high-frequency traces short and away from the edge of the board, and using shielding where possible.
  • Yes, the AUIRF9Z34N is suitable for high-reliability applications, but additional testing and qualification may be required to meet specific industry standards.
  • Troubleshooting the AUIRF9Z34N involves checking the device's operating conditions, verifying proper PCB layout and assembly, and using diagnostic tools such as oscilloscopes and logic analyzers.

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AUIRF9Z34N Overview

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