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AX-SFAZ-1-01-TB05 - onsemi

Description: RF Transceiver SoC, Sigfox™ Verified RCZ4, Ultra-low Power

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AX-SFAZ-1-01-TB05 - onsemi - PCB symbol
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PCB Footprints
AX-SFAZ-1-01-TB05 - onsemi PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN40 7x5, 0.5P CASE 485EG ISSUE A
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3D Models
AX-SFAZ-1-01-TB05 - onsemi - 3D model - Quad Flat No-Lead - QFN40 7x5, 0.5P CASE 485EG ISSUE A
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AX-SFAZ-1-01-TB05 Details

  • Manufacturer Part Number:

    AX-SFAZ-1-01-TB05

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-40

  • Manufacturer Package Code:

    485EG

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    7 mm

  • Number of Functions:

    1

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.2X.27,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    5 mm

AX-SFAZ-1-01-TB05 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the AX-SFAZ-1-01-TB05 can be found in the application note AN5191, which provides guidelines for PCB design, component placement, and thermal management to ensure optimal performance and reliability.
  • The AX-SFAZ-1-01-TB05 has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer between the device and the heat sink or thermal ground plane.
  • The AX-SFAZ-1-01-TB05 is rated for operation from -40°C to 125°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management to prevent overheating and ensure reliable operation.
  • Yes, the AX-SFAZ-1-01-TB05 is qualified for use in high-reliability and automotive applications. It meets the requirements of AEC-Q101 and is manufactured using a process that is compliant with IATF 16949:2016.
  • onsemi provides a troubleshooting guide in the application note AN5191, which covers common issues and their possible causes. Additionally, engineers can contact onsemi's technical support team for assistance with troubleshooting and debugging.

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AX-SFAZ-1-01-TB05 Overview

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