Please enter a minimum 3 letters or numbers
Technical Content
Part Image

AX-SIP-SFEU-1-01-TX30 - onsemi

Description: ON SEMICONDUCTOR - AX-SIP-SFEU-1-01-TX30 - Transceiver Module, PSK, 100bps, 868.13MHz, -125 dBm, 2.1V to 3.6V Supply, SPI

Download AX-SIP-SFEU-1-01-TX30 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
AX-SIP-SFEU-1-01-TX30 - onsemi - PCB symbol
click to zoom
PCB Footprints
AX-SIP-SFEU-1-01-TX30 - onsemi PCB footprint - Other - Other - AX-SIP-SFEU-1-01-TX30-5
click to zoom
3D Models
AX-SIP-SFEU-1-01-TX30 - onsemi - 3D model - Other - AX-SIP-SFEU-1-01-TX30-5
click to zoom

AX-SIP-SFEU-1-01-TX30 Details

  • Manufacturer Part Number:

    AX-SIP-SFEU-1-01-TX30

  • Brand Name:

    ON Semiconductor

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SIP-44

  • Manufacturer Package Code:

    127EU

  • HTS Code:

    8542.31.00.30

  • Date Of Intro:

    2017-09-21

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • JESD-30 Code:

    R-XBCC-N44

  • Length:

    9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVBCC

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.996 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

AX-SIP-SFEU-1-01-TX30 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a 1.5 mm via diameter for optimal thermal performance.
  • Implement a heat sink with a thermal resistance of ≤ 10°C/W, and ensure a maximum junction temperature of 150°C. Also, consider using a thermal interface material with a thermal conductivity of ≥ 1 W/m-K.
  • A 10 μF to 22 μF X7R or X5R ceramic capacitor is recommended for input decoupling. Place the capacitor as close to the VIN pin as possible to minimize parasitic inductance.
  • Use a shielded inductor, keep the layout compact, and minimize loop areas. Ensure a common-mode choke or ferrite bead is used on the input lines. Also, consider using a metal can or shielded enclosure for the entire system.
  • A 10 μF to 22 μF X7R or X5R ceramic capacitor is recommended for output filtering. Place the capacitor as close to the VOUT pin as possible to minimize parasitic inductance.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

AX-SIP-SFEU-1-01-TX30 Overview

Use the download button to access the AX-SIP-SFEU-1-01-TX30 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like AX-SI, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

Parts related to AX-SIP-SFEU-1-01-TX30

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑