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AXK730147G - Panasonic

Description: Conn Board to Board RCP 30 POS 0.4mm Solder ST SMD T/R

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PCB Footprints
AXK730147G - Panasonic PCB footprint - Other - Other - AXK730147G-1
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3D Models
AXK730147G - Panasonic  - 3D model - Other - AXK730147G-1
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AXK730147G Details

  • Manufacturer Part Number:

    AXK730147G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.40

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    8

  • Additional Feature:

    LOW PROFILE

  • Body/Shell Style:

    SOCKET

  • Connector Type:

    BOARD STACKING CONNECTOR

  • Contact Finish Mating:

    GOLD OVER NICKEL

  • Contact Finish Termination:

    Gold (Au) - with Nickel (Ni) barrier

  • Contact Gender:

    FEMALE

  • Contact Material:

    COPPER ALLOY

  • DIN Conformance:

    NO

  • Filter Feature:

    NO

  • IEC Conformance:

    NO

  • JESD-609 Code:

    e4

  • MIL Conformance:

    NO

  • Mating Information:

    MULTIPLE MATING PARTS AVAILABLE

  • Mixed Contacts:

    NO

  • Mounting Style:

    STRAIGHT

  • Mounting Type:

    BOARD

  • Number Of Connectors:

    ONE

  • Number of Rows Loaded:

    2

  • Option:

    GENERAL PURPOSE

  • Terminal Pitch:

    0.4 mm

  • Termination Type:

    SURFACE MOUNT

  • Total Number of Contacts:

    30

  • UL Flammability Code:

    94V-0

AXK730147G Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. Keep the capacitor close to the IC and use a low-ESR capacitor to minimize noise.
  • Ensure good airflow around the device, avoid overheating, and use a heat sink if necessary. Monitor the device's temperature and adjust the operating conditions accordingly.
  • The recommended input voltage range is 2.7V to 5.5V. Operating outside this range may affect the device's performance and reliability.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines. Follow proper handling and storage procedures to prevent ESD damage.
  • The maximum allowable power dissipation is 500mW. Ensure the device operates within this limit to prevent overheating and damage.

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