MORNSUN recommends a PCB layout with a large copper area for heat dissipation, and a minimum of 2oz copper thickness. A thermal via array under the module can also improve heat dissipation.
MORNSUN recommends using a soldering iron with a temperature of 250°C to 270°C, and a soldering time of 3-5 seconds. A soldering flux with a low acidity level is also recommended.
The maximum allowable capacitance for the input capacitor is 220uF, and for the output capacitor is 100uF. Exceeding these values may affect the module's stability and performance.
Yes, the B0505S-1WR3 is designed to withstand vibrations up to 10G. However, it's recommended to secure the module to the PCB using screws or adhesive to prevent damage.
Check the input voltage, output load, and ambient temperature. Ensure the module is properly soldered and the PCB layout is correct. If issues persist, contact MORNSUN's technical support for further assistance.
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