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B40S-SLIM - Diotec

Description: SMD SINGLE PHASE BRIDGE RECTIFIER

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B40S-SLIM - Diotec PCB footprint - Small Outline Packages - Small Outline Packages - SO-DIL SLIM
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B40S-SLIM Details

  • Manufacturer Part Number:

    B40S-SLIM

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-4

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Date Of Intro:

    2019-01-04

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    7.35

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    1.5 µs

  • Reverse Test Voltage:

    80 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

B40S-SLIM Frequently Asked Questions (FAQs)

  • A symmetrical layout with thermal vias and a large copper area on the bottom side of the PCB is recommended to ensure good heat dissipation. The datasheet provides a recommended footprint, but a more detailed layout guide can be found in Diotec's application notes.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Ensure the component is aligned correctly and soldered within 3 seconds to prevent overheating. A soldering guide is available on Diotec's website.
  • The maximum allowed voltage drop is 0.5V, as specified in the datasheet. Exceeding this value may reduce the device's reliability and lifespan. It's essential to ensure the voltage drop is within the specified range to maintain optimal performance.
  • The B40S-SLIM is rated for operation up to 150°C, but derating is required for temperatures above 125°C. Consult the datasheet for derating curves and ensure the device is properly heat-sinked to prevent overheating.
  • Handle the device with ESD-protective equipment, such as wrist straps and mats, to prevent electrostatic discharge. Ensure the PCB is properly grounded, and use ESD-protective packaging during storage and transportation.

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B40S-SLIM Overview

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