B40S2A-SLIM footprint, schematic symbol and 3D model by Diotec

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Part Number B40S2A-SLIM
Manufacturer Diotec
Pin Count 4
Part Category Bridge Rectifier
Package Category Small Outline Packages
Footprint Name Small Outline Packages - B40S2A-SLIM
Released Date Apr 22, 2020
Last Modified Date Mar 7, 2023 4:10 PM UTC
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B40S2A-SLIM Details

Manufacturer Part Number:
B40S2A-SLIM
Rohs Code:
Yes
Part Life Cycle Code:
Active
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
Diotec Semiconductor AG
YTEOL:
7.35
Configuration:
BRIDGE, 4 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
BRIDGE RECTIFIER DIODE
Forward Voltage-Max (VF):
0.95 V
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
72 A
Number of Elements:
4
Number of Phases:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-50 °C
Output Current-Max:
2.3 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Reference Standard:
UL RECOGNIZED
Rep Pk Reverse Voltage-Max:
80 V
Reverse Current-Max:
5 µA
Reverse Recovery Time-Max:
1.5 µs
Reverse Test Voltage:
80 V
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30

B40S2A-SLIM Frequently Asked Questions (FAQs)

A good PCB layout for optimal thermal performance would involve placing the device on a thick copper layer (at least 2 oz) with a large copper area underneath the device to act as a heat sink. Additionally, using thermal vias to connect the top and bottom copper layers can help to dissipate heat more efficiently.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or a thermal interface material to reduce the junction temperature. It's also crucial to ensure good airflow and to avoid overheating the surrounding components.
The recommended soldering conditions for the B40S2A-SLIM are a peak temperature of 260°C (500°F) for a maximum of 10 seconds. It's essential to use a soldering iron with a temperature control and to avoid applying excessive force or pressure during the soldering process.
Yes, the B40S2A-SLIM can be used in switching regulator applications. However, it's essential to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range. Additionally, consider using a snubber circuit to reduce electromagnetic interference (EMI).
To protect the B40S2A-SLIM from electrostatic discharge (ESD), it's essential to handle the device by the body or use an ESD wrist strap or mat. Additionally, consider using ESD protection devices such as TVS diodes or ESD suppressors in the circuit design.

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