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B82432T1102K000 - TDK

Description: Epcos B82432T Series Shielded Wire-wound SMD Inductor with a Ferrite Core, 1 μH ±10% Wire-Wound 1.3A Idc Q:10

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B82432T1102K000 - TDK PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - B82432T1102K000
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B82432T1102K000 Details

  • Manufacturer Part Number:

    B82432T1102K000

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7

  • Case/Size Code:

    1812

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.08 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    DC-DC CONVERTER

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    3.2 mm

  • Package Length:

    4.5 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Blister, 13 Inch

  • Quality Factor-Min (at L-nom):

    10

  • Rated Current-Max:

    1.3 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    110 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    J BEND

  • Test Frequency:

    7.96 MHz

  • Tolerance:

    10%

B82432T1102K000 Frequently Asked Questions (FAQs)

  • The recommended land pattern for B82432T1102K000 can be found in the TDK Corporation's recommended footprint document or by contacting TDK's technical support. The land pattern should ensure proper soldering and thermal management.
  • Proper thermal management is crucial for the reliability and performance of B82432T1102K000. Ensure good thermal conductivity between the component and the PCB by using thermal vias, thermal pads, and a sufficient copper area. Follow TDK's guidelines for thermal management and consult with thermal experts if necessary.
  • While the datasheet specifies the rated temperature range, the maximum operating temperature range may be different. According to TDK, the maximum operating temperature range for B82432T1102K000 is -40°C to +125°C. However, it's recommended to consult with TDK's technical support for specific application requirements.
  • B82432T1102K000 is designed to withstand certain levels of vibration. However, the specific vibration requirements of your application may exceed the component's capabilities. Consult with TDK's technical support to determine the suitability of B82432T1102K000 for your specific vibration environment.
  • To ensure reliability in a humid environment, follow proper storage and handling procedures, and consider using moisture-resistant packaging or coatings. Additionally, ensure that the PCB and component are properly cleaned and dried before assembly. Consult with TDK's technical support for specific guidance on humidity-related concerns.

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B82432T1102K000 Overview

Use the download button to access the B82432T1102K000 schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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Part Image B82432T1102K050 TDK Electronics

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