B88069X2641T502 footprint, schematic symbol and 3D model by TDK

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PCB Footprints

B88069X2641T502 - TDK PCB footprint - Other - Other - B88069X2641T502-1

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Datasheet Download Datasheet
Stock & Prices Price & Stock for B88069X2641T502
Part Number B88069X2641T502
Manufacturer TDK
Pin Count 2
Part Category Undefined or Miscellaneous
Package Category Other
Footprint Name Other - B88069X2641T502-1
Released Date Oct 28, 2021
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

B88069X2641T502 Details

Manufacturer Part Number:
B88069X2641T502
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
ROHS COMPLIANT, PACKAGE-2
HTS Code:
8542.39.00.01
Factory Lead Time:
12 Weeks
Manufacturer:
TDK Corporation
YTEOL:
7
JESD-30 Code:
O-XALF-W2
Number of Functions:
1
Number of Terminals:
2
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
UNSPECIFIED
Package Code:
ALF
Package Shape:
ROUND
Package Style:
LONG FORM
Surface Mount:
NO
Telecom IC Type:
GAS DISCHARGE TUBE SUPPRESSOR
Temperature Grade:
AUTOMOTIVE
Terminal Form:
WIRE
Terminal Position:
AXIAL

B88069X2641T502 Frequently Asked Questions (FAQs)

TDK provides a recommended PCB layout and land pattern in their application notes and design guides. It's essential to follow these guidelines to ensure proper performance and minimize parasitic effects.
While the datasheet provides some information on high-frequency characteristics, it's essential to consult TDK's application notes and simulation models to understand the inductor's behavior under specific switching conditions. Additionally, engineers can perform their own simulations and testing to validate the inductor's performance.
The SRF is typically not specified in the datasheet, but it can be estimated using the inductor's physical characteristics and materials. The SRF can affect the design by causing unwanted resonances and affecting the overall performance of the circuit. Engineers should consider the SRF when designing the circuit and take measures to mitigate its effects.
The temperature coefficient is specified in the datasheet, but its impact on the inductor's performance may not be immediately apparent. Engineers should consider the temperature coefficient when designing the circuit, especially in high-temperature applications, to ensure the inductor's performance remains within acceptable limits.
The MSL is typically specified in the datasheet or in separate documentation. Engineers should ensure that the assembly process meets the MSL requirements to prevent damage to the inductor during reflow soldering or other assembly processes.

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B88069X2641T502 Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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