ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation in high-temperature environments, it is recommended to derate the power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure good thermal design and heat dissipation measures are in place.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a temperature slope of 3°C/s. Refer to the ROHM soldering guidelines for more information.
Yes, the BA30BC0WFP-E2 is designed to withstand vibrations up to 10G. However, it is recommended to follow proper mounting and soldering techniques to ensure reliable operation.
ROHM recommends storing the BA30BC0WFP-E2 in a dry, cool place with a temperature range of 5°C to 30°C and humidity below 60%. Avoid storing the component in direct sunlight or near heat sources.
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BA30BC0WFP-E2 Overview
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