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BA6110 - ROHM Semiconductor

Description: Voltage Controlled op Amp

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PCB Footprints
BA6110 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - SSOP-A16
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BA6110 - ROHM Semiconductor  - 3D model - Small Outline Packages - SSOP-A16
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BA6110 Details

  • Manufacturer Part Number:

    BA6110

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SIP

  • Package Description:

    SIP-9

  • Pin Count:

    9

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    TRANSCONDUCTANCE

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    3000 µV

  • JESD-30 Code:

    R-PSIP-T9

  • Length:

    21.8 mm

  • Low-Bias:

    NO

  • Low-Offset:

    NO

  • Micropower:

    NO

  • Neg Supply Voltage Limit-Max:

    -17 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SIP

  • Package Equivalence Code:

    SIP9,.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    7.2 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage Limit-Max:

    17 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Wideband:

    NO

  • Width:

    2.8 mm

BA6110 Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a solid ground plane and a separate power plane for the BA6110. The input and output pins should be placed on the top layer, and the decoupling capacitors should be placed as close as possible to the device.
  • To ensure stability, make sure to follow the recommended PCB layout, use a sufficient decoupling capacitor (at least 10uF), and keep the input and output impedance matched. Also, avoid using long wires or traces that can cause parasitic inductance.
  • The maximum power dissipation of the BA6110 is 1.5W. However, this value can be affected by the ambient temperature, PCB layout, and other factors. It's recommended to perform thermal simulations and testing to ensure the device operates within a safe temperature range.
  • The BA6110 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at high temperatures. It's recommended to derate the device's power dissipation and ensure proper heat sinking to prevent overheating.
  • To troubleshoot issues with the BA6110, start by checking the power supply voltage, input and output signals, and decoupling capacitors. Use an oscilloscope to verify the signal waveforms and check for any signs of oscillation or instability. Also, review the PCB layout and ensure it meets the recommended design guidelines.

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BA6110 Overview

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